Samsung is not where it would have wanted to be in the HBM3E market. Much has been written about its inability to gain NVIDIA's approval. The AI chip giant remains one of the largest buyers of high-bandwidth memory chips and is largely sourcing from Samsung's local competitor SK Hynix.

There may be some good news on the horizon for Samsung, though. Reports indicate that the company's chips have cleared Broadcom's qualification tests, potentially paving the way to join its HBM3E supply chain.

Korean media is reporting that Samsung's HBM3E 8H high-bandwidth memory chips have cleared Broadcom's qualification tests. Samsung's improved version of the chip has crossed the pre-mass production evaluation stage.

Supply chain diversification is in the interest of companies like Broadcom as the overwhelming reliance on SK Hynix has its own risks. Samsung can provide a viable alternative to mitigate price and supply risks for these companies.

While Broadcom might eventually place an order with Samsung, the company has already begun supplying HBM3E chips to AMD. It recently confirmed that the newest AMD MI350 Series AI chips feature 288GB HBM3E memory chips from Samsung. US-based Micron is also supplying HBM3E chips for AMD's latest accelerators.

Meanwhile, NVIDIA's approval for its HBM3E 12H chips still evades Samsung, with recent reports claiming that they failed their third validation attempt earlier this month. Samsung intends to go through the retest process by September.

The Korean giant is also focusing a lot more on next-generation HBM4 chips, as SK Hynix has recently shipped its HBM4 prototypes to NVIDIA. Samsung is believed to have closed the gap with its rival so it could potentially have a better outcome with the next-generation chips.