Emboldened by the success of the Exynos 2600, Samsung’s chip design division has reportedly accelerated the development of the Exynos 2700. The company has reportedly produced the first samples of the chip for the Galaxy S27 series and sent them to its smartphone division for testing.

A report from Yonhap News Agency reveals that Samsung’s semiconductor chip design division (System LSI) completed the design of the Exynos 2700 in late 2025 and produced the first samples of the smartphone chipset early this year. The company has now reportedly sent those samples to the Samsung Mobile Experience (Samsung MX) division for further testing. The plan is to complete final development in the first half of the year.

The Exynos 2700 will be built on Samsung Foundry’s second-generation 2nm fabrication process (SF2P). It is expected to offer 95% better process capability than the Exynos 2600. It is also expected to widen the gap with competing Qualcomm Snapdragon chips.

Samsung is also expected to use the unified Heat Path Block (HPB) technology with the Exynos 2700. It helps dissipate heat generated by the processor and the RAM faster. It could result in better thermal performance under sustained workloads. Reports suggest that Samsung’s confidence in its in-house chips has grown, and the Exynos 2700 could be used in 50% of all Galaxy S27 series phones.

Early tests of the Exynos 2600 have revealed that its CPU performance is close to that of the Snapdragon 8 Elite Gen 5, while its GPU performance is slightly better. There have also been no severe thermal throttling complaints so far, suggesting that Samsung has made a strong comeback and is trying to move past the negative perception created by the Exynos 990 and the Exynos 2200.

Samsung has revealed that it plans to use Exynos chips in more Galaxy devices in the future. With prices of processors and memory chips skyrocketing, going with in-house Exynos chips will be relatively cheaper for the company.